Inkjet and Material-Jetting Deposition of Photocurable Encapsulants for MEMS and Microsensors: Registration, Interfaces and Reliability

Inkjet and material-jetting of photocurable encapsulants for MEMS and microsensors couples droplet placement, cure, interfacial adhesion and package reliability. This review examines registration to small features, deposited-film geometry, wetting, voiding, cure state and thermomechanical stability rather than treating encapsulation as a coating-thickness problem. Reliability studies of inkjet- printed electronic packages show that printed material properties and cure history can control stress and deformation under thermal loading, while UV-LED-curable ink literature defines formulation and jetting constraints relevant to deposited encapsulants. Qualification is organised around deposited footprint, keep-out compliance, interface integrity, cure/conversion evidence, leakage or insulation function, and environmental/thermal cycling. The objective is to distinguish failures created at deposition from failures created later by cure shrinkage, moisture uptake, modulus mismatch or interfacial degradation.

ER-336 · Version 0.4.